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KB6160
TG130
Green Solder resist
Laser Blind buried VIAS
High DENSITY PCB
UL Certification
KB6160
Heavy Enig Finishment
High Density pcb
Green Solder resist
UL Certification
KB6160
MATT SUNCHEMICAL SOLDER RESIST
OSP FINISHMENT
UL USA and CANADIAN
MADE IN ITALY ON BOARDS LOGO
KB6160
Heavy Enig Finishment
High Copper PCB 4OZ 140 um finish
Blue Solder resist
UL Certification
KB6160
MATT SUNCHEMICAL SOLDER RESIST
OSP FINISHMENT
UL USA and CANADIAN
MADE IN ITALY ON BOARDS LOGO
Printed circuit KB 6160
Material characteristics:
KB-6160 （ANSI：FR-4）Fiberglass laminate
- 130℃ (By DSC), low Z-axis expansion
- High Temperature of Decomposition (Td)
- Excellent heat resistance and appropriate for Lead Free Assembly.
- IPC-4101B/124 specification is applicable
- Dicy –free and no filler
- ANTI-CAF
Application areas:
- Tg : 130°
- Dk(1 MHz) : 4.58
- Df(1 MHz) : 0.022