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KB6160C
CTI600
BIG SIZE PCB
White Sunchemical Solder Resist
OSP Finshment
KB6160C
CTI600
Green Solder resist
Heavy volume pcb board
UL Certification
KB6160C
CTI600
Heavy Enig Finishment
Blue Solder resist
UL Certification
KB6160C
CTI600
0,4 mm material thickness
White Sunchemical Solder Resist
OSP Finshment
Printed circuit KB 6160C
Material characteristics:
KB-6165 （ANSI：FR-4）Fiberglass laminate
- 150℃ (By DSC), low Z-axis expansion
- High Temperature of Decomposition (Td)
- Excellent heat resistance and appropriate for Lead Free Assembly.
- IPC-4101B/124 specification is applicable
- Dicy –free and no filler
- ANTI-CAF
Application areas:
- Tg : 135°
- Dk(1 MHz) : 4.58
- Df(1 MHz) : 0.022