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KB 6165+VENTEC VT42 INNER
CTI 600 MULTILAYERS PCB
Mixed Material Rigid Board
Green Solder resist
Laser Blind buried VIAS
HDI BOARD
3/3 mils
UL Certification
Printed circuit KB 6165
Material characteristics:
KB-6165 （ANSI：FR-4）Fiberglass laminate
- 150℃ (By DSC), low Z-axis expansion
- High Temperature of Decomposition (Td)
- Excellent heat resistance and appropriate for Lead Free Assembly.
- IPC-4101B/124 specification is applicable
- Dicy –free and no filler
- ANTI-CAF
Application areas:
Industrial / Robotics /
- Tg : 153°
- Dk(1 MHz) : 4.65
- Df(1 MHz) : 0.018